Journal Article

2023

BICK, M., C. DONG, A. SAXENA, A. SABIA

On the Journey to AI Maturity

AIS TRANSACTIONS ON ENTERPRISE SYSTEMS, 2023, vol. Vol. 6 No. 1

Journal Article

2023

BICK, M., S. BRAUNER, M. MURAWSKI

The development of a competence framework for artificial intelligence professionals using probabilistic topic modelling

Forthcoming JOURNAL OF ENTERPRISE INFORMATION MANAGEMENT

Journal Article

2023

BICK, M., T. THORDSEN

The Importance of Platforms to Achieve Digital Maturity

LECTURE NOTES IN BUSINESS INFORMATION PROCESSING, 2023, vol. 464, pp. 339–351

Journal Article

2023

BÖCKLE, M., M. BICK, J. NOVAK

Toward a Design Theory of User-Centered Score Mechanics for Gamified Competency Development

INFORMATION SYSTEMS MANAGEMENT, 2023, vol. 40(1), pp. 2-28

Journal Article

2023

BICK, M., M. DARVISH, L. KERESZTYEN

Virtual Immersive Workplaces: The New Norm? – A Qualitative Study on the Impact of VR in the Workplace

LECTURE NOTES IN BUSINESS INFORMATION PROCESSING, 2023, vol. 464, pp. 665–677

Journal Article

2022

BICK, M., T. BLESIK, T. -F. KUMMER

A Conceptualisation of Crowd Knowledge

INFORMATION SYSTEMS FRONTIERS, 2022, vol. 24(5), pp. 1647-1665

Journal Article

2022

BICK, M., P. -H. SHIH, M. MURAWSKI

Blockchain Application in Luxury Brand Strategy: What Does Blockchain Technology Mean to Luxury Brands?

LECTURE NOTES IN BUSINESS INFORMATION PROCESSING, 2022, vol. 437, pp. 102-116

Journal Article

2022

BICK, M., S. RÖHM , M. BÖCKLE

The Impact of Artificial Intelligence on the Investment Decision Process in Venture Capital Firms

LECTURE NOTES IN COMPUTER SCIENCE, 2022, vol. 13336, pp. 420–435

Journal Article

2022

BICK, M., R. DI GIANNANTONIO,, M. MURAWSKI

The Impact of Machine Learning-Based Techniques on the Scouting and Screening Processes of Early-Stage Venture Capital Firms

LECTURE NOTES IN COMPUTER SCIENCE, 2022, vol. Vol 13454

Journal Article

2022

BICK, M., M. DARVISH, M. MURAWSKI

Towards a New Value Chain for the Audio Industry

LECTURE NOTES IN BUSINESS INFORMATION PROCESSING, 2022, vol. 437, pp. 694–704

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